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| MCP73113/4 Single-Cell Li-Ion / Li-Polymer Battery Charge Management Controller with Input Overvoltage Protection Features * Complete Linear Charge Management Controller: - Integrated Input Overvoltage Protection - Integrated Pass Transistor - Integrated Current Sense - Integrated Reverse Discharge Protection * Constant Current / Constant Voltage Operation with Thermal Regulation * 4.15V Undervoltage Lockout (UVLO) * 18V Absolute Maximum Input with OVP: - 6.5V (MCP73113) - 5.8V (MCP73114) * High Accuracy Preset Voltage Regulation Through Full Temperature Range (-5C to +55C): +0.5% * Battery Charge Voltage Options: - 4.10V, 4.20V, 4.35V or 4.4V * Resistor Programmable Fast Charge Current: - 130 mA - 1100 mA * Preconditioning of Deeply Depleted Cells - Available Options: 10% or Disable * Integrated Precondition Timer: - 32 Minutes or Disable * Automatic End-of-Charge Control: - Selectable Minimum Current Ratio: 5%, 7.5%, 10% or 20% - Elapse Safety Timer: 4 HR, 6 HR, 8 HR or Disable * Automatic Recharge: - Available Options: 95% or Disable * Charge Status Output - Two Style Options * Soft start * Temperature Range: -40C to +85C * Packaging: DFN-10 (3 mm x 3 mm) Description The MCP73113/4 are highly integrated Li-Ion battery charge management controllers for use in space-limited and cost-sensitive applications. The MCP73113/4 devices provide specific charge algorithms for Li-Ion/Li-Polymer batteries to achieve optimal capacity and safety in the shortest charging time possible. Along with their small physical size, the low number of external components make the MCP73113/4 ideally suitable for portable applications. The absolute maximum voltage, up to 18V, allows the use of MCP73113/4 in harsh environments, such as low cost wall wart or voltage spikes from plug/unplug. The MCP73113/4 devices employ a constant current/constant voltage charge algorithm. The various charging voltage regulations provide design engineers flexibility to use in different applications. The fast charge, constant current value is set with one external resistor from 130 mA to 1100 mA. The MCP73113/4 devices limit the charge current based on die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. The PROG pin of the MCP73113/4 also serves as enable pin. When high impedance is applied, the MCP73113/4 will be in standby mode. The MCP73113/4 devices are fully specified over the ambient temperature range of -40C to +85C. They are available in a 10 lead, DFN package. Package Types (Top View) MCP73113/4 3x3 DFN * VDD 1 VDD 2 VBAT 3 VBAT 4 NC 5 EP 11 10 PROG 9 VSS 8 VSS 7 STAT 6 NC Applications * * * * * * * Low-Cost Li-Ion/Li-Poly Battery Chargers MP3 Players Digital Still Camera Portable Media Players Handheld Devices Bluetooth Headsets USB Chargers * Includes Exposed Thermal Pad (EP); see Table 3-1. (c) 2010 Microchip Technology Inc. DS22183C-page 1 MCP73113/4 Typical Application MCP73113/4 Typical Application 1 Ac-dc Adapter 2 CIN RLED 7 VDD VDD STAT VBAT 3 COUT VBAT 4 PROG VSS 10 9 + 1-Cell Li-Ion Battery 5 NC 6 NC RPROG - VSS 8 TABLE 1: Charge Voltage 4.10V 4.20V 4.35V 4.40V Note 1: 2: 3: 4: 5: 6: 7: AVAILABLE FACTORY PRESET OPTIONS OVP Preconditioning Charge Current Disable / 10% Disable / 10% Disable / 10% Disable / 10% Preconditioning Threshold 66.5% / 71.5% 66.5% / 71.5% 66.5% / 71.5% 66.5% / 71.5% Precondition Timer Disable / 32 Minimum Disable / 32 Minimum Disable / 32 Minimum Disable / 32 Minimum Elapse Timer Disable / 4 HR / 6 HR / 8 HR Disable / 4 HR / 6 HR / 8 HR Disable / 4 HR / 6 HR / 8 HR Disable / 4 HR / 6 HR / 8 HR End-ofCharge Control 5% / 7.5% / 10% / 20% 5% / 7.5% / 10% / 20% 5% / 7.5% / 10% / 20% 5% / 7.5% / 10% / 20% Automatic Recharge No / Yes No / Yes No / Yes No / Yes Output Status Type 1 / Type 2 Type 1 / Type 2 Type 1 / Type 2 Type 1 / Type 2 5.8V / 6.5V 5.8V / 6.5V 5.8V / 6.5V 5.8V / 6.5V IREG: Regulated fast charge current. VREG: Regulated charge voltage. IPREG/IREG: Preconditioning charge current; ratio of regulated fast charge current. ITERM/IREG: End-of-Charge control; ratio of regulated fast charge current. MCP73113: VOVP = 6.5V, MCP73114: VOVP = 5.8V. VRTH/VREG: Recharge threshold; ratio of regulated battery voltage. VPTH/VREG: Preconditioning threshold voltage. TABLE 2: Part Number STANDARD SAMPLE OPTIONS VREG 4.10V 4.20V 4.20V OVP 6.5V 6.5V 5.8V IPREG/IREG 10% 10% 10% Pre-charge Timer 32 Min. 32 Min. 32 Min. Elapse Timer 6 HR 6 HR 6 HR ITERM/IREG VRTH/VREG VPTH/VREG 10% 10% 10% 95% 95% 95% 71.5% 71.5% 71.5% Output Status Type 1 Type 1 Type 1 MCP73113-16S/MF MCP73113-06S/MF MCP73114-0NS/MF Note 1: Customers should contact their distributor, representatives or field application engineer (FAE) for support and sample. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the web site at: http//support.microchip.com. DS22183C-page 2 (c) 2010 Microchip Technology Inc. MCP73113/4 Functional Block Diagram VOREG Direction Control VDD Current Limit VBAT + VREF - PROG + CA Reference, Bias, UVLO, AND SHDN VOREG VREF (1.21V) UVLO Term - + Precondition + STAT Charge Control, Timer, and Status Logic Charge + VA Input OverVP 95% VREG VBAT + 110C TSD - Thermal Regulation (c) 2010 Microchip Technology Inc. - + + + 5.8 / 6.5V VDD VSS *Recharge *Only available on selected options DS22183C-page 3 MCP73113/4 NOTES: DS22183C-page 4 (c) 2010 Microchip Technology Inc. MCP73113/4 1.0 ELECTRICAL CHARACTERISTICS Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings VDD ................................................................................18.0V VPROG ..............................................................................6.0V All Inputs and Outputs w.r.t. VSS ............... -0.3 to (VDD+0.3)V Maximum Junction Temperature, TJ ............ Internally Limited Storage temperature .....................................-65C to +150C ESD protection on all pins Human Body Model (1.5 k in Series with 100 pF)....... 4 kV Machine Model (200 pF, No Series Resistance) .............300V DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (Typical) + 1.0V] Parameters Supply Input Input Voltage Range Operating Supply Voltage Supply Current VDD VDD ISS 4 4.2 -- -- -- -- Battery Discharge Current Output Reverse Leakage Current IDISCHARGE -- -- 0.5 0.5 6 Undervoltage Lockout UVLO Start Threshold UVLO Stop Threshold UVLO Hysteresis Overvoltage Protection OVP Start Threshold OVP Hysteresis Regulated Output Voltage Options VOVP VOVPHYS VREG 6.4 5.8 -- 4.079 4.179 4.328 4.378 Output Voltage Tolerance Line Regulation Load Regulation Supply Ripple Attenuation Note 1: VRTOL |(VBAT/VBAT) /VDD| |VBAT/VBAT| PSRR -0.5 -- -- -- -- Not production tested. Ensured by design. Voltage Regulation (Constant Voltage Mode) 4.10 4.20 4.35 4.40 -- 0.05 0.05 -46 -30 4.121 4.221 4.372 4.422 0.5 0.20 0.20 -- -- V V V V % %/V % dB dB VDD = [VREG(Typical)+1V] to 6V IOUT = 50 mA IOUT = 50 mA - 150 mA VDD = [VREG(Typical)+1V] IOUT = 20 mA, 10 Hz to 1 kHz IOUT = 20 mA, 10 Hz to 10 kHz TA = -5C to 55C VDD = [VREG(Typical)+1V] IOUT = 50 mA 6.5 5.9 150 6.6 6.0 -- V V mV MCP73113 MCP73114 VSTART VSTOP VHYS 4.10 4.00 -- 4.15 4.05 100 4.25 4.15 -- V V mV 2 2 17 A A A Standby (PROG Floating) Shutdown (VDD < VBAT, or VDD < VSTOP) Charge Complete; VDD is present -- -- 4 700 30 50 16 6.5 5.5 1500 100 150 V V A A A A Shutdown (VDD < VBAT - 150 mV) Charging Standby (PROG Floating) Charge Complete; No Battery; VDD < VSTOP Sym Min Typ Max Units Conditions (c) 2010 Microchip Technology Inc. DS22183C-page 5 MCP73113/4 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(Typical) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (Typical) + 1.0V] Parameters Battery Short Protection BSP Start Threshold BSP Hysteresis BSP Regulation Current Fast Charge Current Regulation VSHORT VBSPHYS ISHORT IREG -- -- -- 130 117 900 Charge Current Tolerance Precondition Current Ratio IRTOL IPREG / IREG -- 8 -- Precondition Voltage Threshold Ratio Precondition Hysteresis Charge Termination Charge Termination Current Ratio ITERM / IREG 3.75 5.6 7.5 15 Automatic Recharge Recharge Voltage Threshold Ratio VRTH / VREG 93 -- Pass Transistor ON-Resistance ON-Resistance Status Indicator - STAT Sink Current Low Output Voltage Input Leakage Current PROG Input Charge Impedance Range Shutdown Impedance PROG Voltage Range Automatic Power Down Automatic Power Down Entry Threshold Automatic Power Down Exit Threshold Thermal Shutdown Die Temperature Die Temperature Hysteresis Note 1: TSD TSDHYS -- -- 150 10 -- -- C C VPDENTRY VPDEXIT VBAT + 10 mV -- VBAT + 50 mV VBAT + 150 mV -- VBAT + 250 mV V V 2.3V < VBAT < VREG VDD Falling 2.3V < VBAT < VREG VDD Rising RPROG RPROG VPROG 1 70 0 -- 200 -- 21 -- 5 k k V Impedance for Shutdown ISINK VOL ILK -- -- -- 20 0.2 0.001 35 0.5 1 mA V A ISINK = 4 mA High Impedance, VDD on pin RDSON -- 350 -- m VDD = 4.5V, TJ = 105C (Note 1) 95.0 0 97 -- % % VBAT High-to-Low No Automatic Recharge 5 7.5 10 20 6.25 9.4 12.5 25 % % % % PROG = 1 k to 10 k TA = -5C to +55C VPTH / VREG VPHYS 64 69 -- 1.7 150 25 -- 130 1000 10 10 100 66.5 71.5 100 -- -- -- 1100 143 1100 -- 15 -- 69 74 -- V mV mA mA mA mA % % % % % mV VBAT High-to-Low (Note 1) PROG = 1 k to 10 k TA = -5C to +55C No Preconditioning VBAT Low-to-High TA = -5C to +55C PROG = 10 k PROG = 1.1 k Sym Min Typ Max Units Conditions Current Regulation (Fast Charge, Constant-Current Mode) Preconditioning Current Regulation (Trickle Charge Constant Current Mode) Not production tested. Ensured by design. DS22183C-page 6 (c) 2010 Microchip Technology Inc. MCP73113/4 AC CHARACTERISTICS Electrical Specifications: Unless otherwise specified, all limits apply for VDD= [VREG(Typical)+0.3V] to 6V, TA=-40C to +85C. Typical values are at +25C, VDD= [VREG(Typical)+1.0V] Parameters Elapsed Timer Elapsed Timer Period tELAPSED -- 3.6 5.4 7.2 Preconditioning Timer Preconditioning Timer Period Status Indicator Status Output turn-off Status Output turn-on, Note 1: tOFF tON -- -- -- -- 500 500 s ISINK = 1 mA to 0 mA (Note 1) ISINK = 0 mA to 1 mA (Note 1) tPRECHG -- 0.4 0 0.5 -- 0.6 Hours Hours Disabled Timer 0 4.0 6.0 8.0 -- 4.4 6.6 8.8 Hours Hours Hours Hours Timer Disabled Sym Min Typ Max Units Conditions Not production tested. Ensured by design. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG (Typical) + 0.3V] to 6V. Typical values are at +25C, VDD = [VREG (Typical) + 1.0V] Parameters Temperature Ranges Specified Temperature Range Operating Temperature Range Storage Temperature Range Thermal Package Resistances Thermal Resistance, DFN-10 (3x3) JA -- 43 -- C/W 4-Layer JC51-7 Standard Board, Natural Convection TA TJ TA -40 -40 -65 -- -- -- +85 +125 +150 C C C Sym Min Typ Max Units Conditions (c) 2010 Microchip Technology Inc. DS22183C-page 7 MCP73113/4 NOTES: DS22183C-page 8 (c) 2010 Microchip Technology Inc. MCP73113/4 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 50 mA and TA= +25C, Constant-voltage mode. 4.220 4.215 4.210 4.205 4.200 4.195 4.190 4.185 4.180 4.5 4.8 5.0 5.3 5.5 5.8 6.0 Supply Voltage(V) 4.220 4.215 4.210 4.205 4.200 4.195 4.190 4.185 4.180 4.175 4.170 -5 5 15 25 35 45 55 Ambient Temperature (C) ILOAD = 150 mA VDD = 5.2V I LOAD = 50 mA VBAT = 4.2V TA = +25C FIGURE 2-1: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). 4.220 FIGURE 2-4: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). 1200 1100 1000 900 800 700 600 500 400 300 200 100 0 Battery Regulation Voltage (V) Battery Regulation Voltage (V) Battery Regulation Voltage (V) 4.210 4.205 4.200 4.195 4.190 4.185 4.180 4.5 4.8 5.1 5.4 Charge Current (mA) 4.215 I LOAD = 150 mA VBAT = 4.2V TA = +25C VDD = 5.2V TA = +25C 5.7 6.0 1 2 3 4 5 6 7 8 9 10 1112 13 141516 1718 19 20 Programming Resistor (k) Supply Voltage (V) FIGURE 2-2: Battery Regulation Voltage (VBAT) vs. Supply Voltage (VDD). 4.220 4.215 4.210 4.205 4.200 4.195 4.190 4.185 4.180 4.175 4.170 -5 5 15 25 35 45 55 Ambient Temperature (C) ILOAD = 50 mA VDD = 5.2V FIGURE 2-5: Charge Current (IOUT) vs. Programming Resistor (RPROG). 950 930 910 890 870 850 830 810 790 770 750 4.5 Battery Regulation Voltage (V) Charge Current (mA) RPROG = 1.33 k TA = +25C 4.8 5.1 5.4 5.7 6.0 Supply Voltage (V) FIGURE 2-3: Battery Regulation Voltage (VBAT) vs. Ambient Temperature (TA). FIGURE 2-6: Charge Current (IOUT) vs. Supply Voltage (VDD). (c) 2010 Microchip Technology Inc. DS22183C-page 9 MCP73113/4 TYPICAL PERFORMANCE CURVES (CONTINUED) Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode. 675 655 635 615 595 575 555 535 515 495 475 80 77 74 71 68 65 62 59 56 53 50 4.5 Charge Current (mA) Charge Curent (mA) RPROG = 2 k TA = +25C RPROG = 20 k TA = +25C 4.8 5.1 5.4 5.7 6.0 4.5 4.8 5.1 5.4 5.7 6.0 Supply Voltage (V) Supply Voltage (V) FIGURE 2-7: Charge Current (IOUT) vs. Programming Resistor (RPROG). 350 330 310 290 270 250 230 210 190 170 150 4.5 FIGURE 2-10: Charge Current (IOUT) vs. Programming Resistor (RPROG). 950 930 Charge Current (mA) 910 890 870 850 830 810 790 770 750 RPROG = 1.33 k VDD = 5.2V -5 5 15 25 35 45 55 Charge Current (mA) RPROG = 5 k TA = +25C 4.8 5.1 5.4 5.7 6.0 Supply Voltage (V) Ambient Temperature (C) FIGURE 2-8: Charge Current (IOUT) vs. Programming Resistor (RPROG). 150 144 138 132 126 120 114 108 102 96 90 4.5 FIGURE 2-11: Charge Current (IOUT) vs. Ambient Temperature (TA). 9.0 8.0 7.0 6.0 5.0 End of Charge 4.0 3.0 2.0 VDD < VBAT 1.0 0.0 VDD < VSTOP -1.0 -5.0 5.0 15.0 RPROG = 10 k TA = +25C 4.8 5.1 5.4 5.7 6.0 Discharge Current (uA) Fast Charge (mA) 25.0 35.0 45.0 55.0 Supply Voltage (V) Ambient Temperature (C) FIGURE 2-9: Charge Current (IOUT) vs. Programming Resistor (RPROG). FIGURE 2-12: Output Leakage Current (IDISCHARGE) vs. Ambient Temperature (TA). DS22183C-page 10 (c) 2010 Microchip Technology Inc. MCP73113/4 TYPICAL PERFORMANCE CURVES (CONTINUED) Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25C, Constant-voltage mode. 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 R PROG = 2 k 875 mAh Battery Battery Voltage (V) Input Voltage Battery Voltage 0.2 0.1 0 105 120 15 30 45 60 75 90 Time (Minutes) FIGURE 2-13: (50 ms/Div). Overvoltage Protection Start FIGURE 2-16: Complete Charge Cycle (875 mAh Li-Ion Battery. Input Voltage Battery Voltage Charge Current Source Voltage (V) Output Ripple (V) FIGURE 2-14: (50 ms/Div). Overvoltage Protection Stop FIGURE 2-17: Line Transient Response (ILOAD = 10 mA, Output: 1.0V/Div, Source: 2.0V/Div). Output Ripple (mV) Source Voltage (V) Output Ripple (V) Output Current (mA) FIGURE 2-15: Load Transient Response (ILOAD = 50 mA, Output: 100 mV/Div, Time: 100 s/Div). FIGURE 2-18: Line Transient Response (ILOAD = 100 mA, Output: 1.0V/Div, Source: 2.0V/Div). (c) 2010 Microchip Technology Inc. DS22183C-page 11 Supply Current (A) Charge Current 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 MCP73113/4 NOTES: DS22183C-page 12 (c) 2010 Microchip Technology Inc. MCP73113/4 3.0 PIN DESCRIPTION PIN FUNCTION TABLES Symbol I/O Function The descriptions of the pins are listed in Table 3-1. TABLE 3-1: MCP73113/4 DFN-10 1, 2 3, 4 5, 6 7 8, 9 10 11 VDD VBAT NC STAT VSS PROG EP I I/O O I/O -- Battery Management Input Supply Battery Charge Control Output No Connection Battery Charge Status Output Battery Management 0V Reference Battery Charge Current Regulation Program and Charge Control Enable Exposed Pad 3.1 Battery Management Input Supply (VDD) 3.6 Current Regulation Set (PROG) A supply voltage of [VREG (Typical) + 0.3V] to 6.0V is recommended. Bypass to VSS with a minimum of 1 F. The VDD pin is rated 18V absolute maximum to prevent suddenly rise of input voltage from spikes or low cost ac-dc wall adapter. The fast charge current is set by placing a resistor from PROG to VSS during constant current (CC) mode. PROG pin is rated up to 5V with 6V absolute maximum value. PROG pin also serves as charge control enable. When a typical 200 k impedance is applied to PROG pin, the MCP73113/4 device is disabled until the high impedance is removed. Refer to Section 5.5 "Constant Current MODE - Fast Charge" for details. 3.2 Battery Charge Control Output (VBAT) Connect to the positive terminal of the battery. Bypass to VSS with a minimum of 1 F to ensure loop stability when the battery is disconnected. 3.7 Exposed Pad (EP) 3.3 No Connect (NC) No connect. 3.4 Battery Management 0V Reference (VSS) The Exposed Thermal Pad (EP) shall be connected to the exposed copper area on the Printed Circuit Board (PCB) for the thermal enhancement. Additional vias on the copper area under the MCP73113/4 device can improve the performance of heat dissipation and simplify the assembly process. Connect to the negative terminal of the battery and input supply. 3.5 Status Output (STAT) STAT is an open-drain logic output for connection to an LED for charge status indication in standalone applications. Alternatively, a pull-up resistor can be applied for interfacing to a host microcontroller. Refer to Table 5-1 for a summary of the status output during a charge cycle. (c) 2010 Microchip Technology Inc. DS22183C-page 13 MCP73113/4 NOTES: DS22183C-page 14 (c) 2010 Microchip Technology Inc. MCP73113/4 4.0 DEVICE OVERVIEW The MCP73113/4 are simple, but fully integrated linear charge management controllers. Figure 4-1 depicts the operational flow algorithm. SHUTDOWN MODE VDD < VUVLO VDD < VPD or PROG > 200 k STAT = HI-Z VBAT < VPTH VDD < VOVP PRECONDITIONING MODE Charge Current = IPREG STAT = LOW Timer Reset Timer Enable Timer Expired TIMER FAULT No Charge Current STAT = Flashing (Op.1) STAT = Hi-Z (Op.2) Timer Suspended VDD > VOVP VDD > VOVP VBAT > VPTH VBAT > VPTH OVERVOLTAGE PROTECTION No Charge Current STAT = Hi-Z Timer Suspended FAST CHARGE MODE Charge Current = IREG STAT = LOW Timer Reset Timer Enabled Timer Expired VBAT < VRTH TIMER FAULT No Charge Current STAT = Flashing (Op.1) STAT = Hi-Z (Op.2) Timer Suspended VDD > VOVP VDD < VOVP VBAT = VREG VDD < VOVP CONSTANT VOLTAGE MODE Charge Voltage = VREG STAT = LOW VBAT < ITERM Die Temperature < TSDHYS Charge Mode Resume CHARGE COMPLETE MODE No Charge Current STAT = HI-Z Timer Reset VBAT > VSHORT Charge Mode Resume Die Temperature > TSD VBAT < VSHORT TEMPERATURE FAULT No Charge Current STAT = Flashing (Op.1) STAT = Hi-Z (Op.2) Timer Suspended BATTERY SHORT PROTECTION Charge Current = ISHORT STAT = Flashing (Op.1) STAT = Hi-Z (Op.2) Timer Suspended FIGURE 4-1: The MCP73113/4 Flow Chart. (c) 2010 Microchip Technology Inc. DS22183C-page 15 MCP73113/4 NOTES: DS22183C-page 16 (c) 2010 Microchip Technology Inc. MCP73113/4 5.0 5.1 DETAILED DESCRIPTION Undervoltage Lockout (UVLO) 5.3.2 BATTERY CHARGE CONTROL OUTPUT (VBAT) An internal undervoltage lockout (UVLO) circuit monitors the input voltage and keeps the charger in shutdown mode until the input supply rises above the UVLO threshold. In the event a battery is present when the input power is applied, the input supply must rise approximately 150 mV above the battery voltage before the MCP73113/4 device becomes operational. The UVLO circuit places the device in shutdown mode if the input supply falls to approximately 150 mV above the battery voltage.The UVLO circuit is always active. At any time, the input supply is below the UVLO threshold or approximately 150 mV of the voltage at the VBAT pin, the MCP73113/4 device is placed in a shutdown mode. The battery charge control output is the drain terminal of an internal P-channel MOSFET. The MCP73113/4 devices provide constant current and voltage regulation to the battery pack by controlling this MOSFET in the linear region. The battery charge control output should be connected to the positive terminal of the battery pack. 5.3.3 BATTERY DETECTION The MCP73113/4 detects the battery presence with charging of the output capacitor. The charge flow will initiate when the voltage on VBAT is pulled below the VRECHARGE threshold. Refer to Section 1.0 "Electrical Characteristics" for VRECHARGE values. The value will be the same for non-rechargeable device. When VBAT > VREG + Hysteresis, the charge will be suspended or not started, depends on the condition to prevent over charge that may occur. 5.2 Overvoltage Protection (OVP) An internal overvoltage protection (OVP) circuit monitors the input voltage and keeps the charger in shutdown mode when the input supply rises above the OVP threshold. The hysteresis of OVP is approximately 150 mV for the MCP73113/4 device. The MCP73113/4 device is operational between UVLO and OVP threshold. The OVP circuit is also recognized as overvoltage lock out (OVLO). 5.4 Preconditioning If the voltage at the VBAT pin is less than the preconditioning threshold, the MCP73113/4 device enters a preconditioning mode. The preconditioning threshold is factory set. Refer to Section 1.0 "Electrical Characteristics" for preconditioning threshold options. In this mode, the MCP73113/4 device supplies 10% of the fast charge current (established with the value of the resistor connected to the PROG pin) to the battery. When the voltage at the VBAT pin rises above the pre-conditioning threshold, the MCP73113/4 device enters the constant current (fast charge) mode. Note: The MCP73113/4 also offer options with no preconditioning. 5.3 Charge Qualification When the input power is applied, the input supply must rise 150 mV above the battery voltage before the MCP73113/4 becomes operational. The automatic power down circuit places the device in a shutdown mode if the input supply falls to within +50 mV of the battery voltage. The automatic circuit is always active. At any time the input supply is within +50 mV of the voltage at the VBAT pin, the MCP73113/4 is placed in a shutdown mode. For a charge cycle to begin, the automatic power down conditions must be met and the charge enable input must be above the input high threshold. 5.4.1 TIMER EXPIRED DURING PRECONDITIONING MODE 5.3.1 BATTERY MANAGEMENT INPUT SUPPLY (VDD) The VDD input is the input supply to the MCP73113/4. The MCP73113/4 automatically enters a Power-down mode if the voltage on the VDD input falls to within +50 mV of the battery voltage. This feature prevents draining the battery pack when the VDD supply is not present. If the internal timer expires before the voltage threshold is reached for fast charge mode, a timer fault is indicated and the charge cycle terminates. The MCP73113/4 device remains in this condition until the battery is removed or input power is cycled. If the battery is removed, the MCP73113/4 device enters the standby mode where it remains until a battery is reinserted. Note: The typical preconditioning timer for MCP73113/4 is 32 minutes. The MCP73113/4 also offer options with no preconditioning timer. (c) 2010 Microchip Technology Inc. DS22183C-page 17 MCP73113/4 5.5 Constant Current MODE - Fast Charge Constant current mode is maintained until the voltage at the VBAT pin reaches the regulation voltage, VREG. When constant current mode is invoked, the internal timer is reset. During the constant current mode, the programmed charge current is supplied to the battery or load. The charge current is established using a single resistor from PROG to VSS. The program resistor and the charge current are calculated using the following equations: 5.5.1 TIMER EXPIRED DURING CONSTANT CURRENT - FAST CHARGE MODE EQUATION 5-1: I REG = 1104 x R Where: RPROG IREG = = kilo-ohms (k) milliampere (mA) - 0.93 If the internal timer expires before the recharge voltage threshold is reached, a timer fault is indicated and the charge cycle terminates. The MCP73113/4 device remains in this condition until the battery is removed. If the battery is removed or input power is cycled, the MCP73113/4 device enters the Stand-by mode where it remains until a battery is reinserted. 5.6 Constant Voltage Mode EQUATION 5-2: R PROG = 10 Where: RPROG IREG = = kilo-ohms (k) milliampere (mA) I REG log ----------- ( - 0.93 ) 1104 When the voltage at the VBAT pin reaches the regulation voltage, VREG, constant voltage regulation begins. The regulation voltage is factory set to 4.10V, 4.20V, 4.35V or 4.40V with a tolerance of 0.5%. 5.7 Charge Termination Table 5-1 provides commonly seen E96 (1%) and E24 (5%) resistors for various charge current to reduce design time. TABLE 5-1: RESISTOR LOOKUP TABLE Charge Recommended Recommended Current (mA) E96 Resistor () E24 Resistor () 130 150 200 250 300 350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1100 10k 8.45k 6.20k 4.99k 4.02k 3.40k 3.00k 2.61k 2.32k 2.10k 1.91k 1.78k 1.62k 1.50k 1.40k 1.33k 1.24k 1.18k 1.10k 1.00k 10k 8.20k 6.20k 5.10k 3.90k 3.30k 3.00k 2.70k 2.37k 2.20k 2.00k 1.80k 1.60k 1.50k 1.50k 1.30k 1.20k 1.20k 1.10k 1.00k The charge cycle is terminated when, during constant voltage mode, the average charge current diminishes below a threshold established with the value of 5%, 7.5%, 10% or 20% of fast charge current or internal timer has expired. A 1 ms filter time on the termination comparator ensures that transient load conditions do not result in premature charge cycle termination. The timer period is factory set and can be disabled. Refer to Section 1.0 "Electrical Characteristics" for timer period options. 5.8 Automatic Recharge The MCP73113/4 device continuously monitors the voltage at the VBAT pin in the charge complete mode. If the voltage drops below the recharge threshold, another charge cycle begins and current is once again supplied to the battery or load. The recharge threshold is factory set. Refer to Section 1.0 "Electrical Characteristics" for recharge threshold options. Note: The MCP73113/4 also offer options with no automatic recharge. For the MCP73113/4 devices with no recharge option, the MCP73113/4 will go into standby mode when termination condition is met. The charge will not restart until the following conditions have been met: * Battery is removed from the system and inserted again * VDD is removed and plugged in again * RPROG is disconnected (or high impedance) and reconnected DS22183C-page 18 (c) 2010 Microchip Technology Inc. MCP73113/4 5.9 THERMAL REGULATION TABLE 5-2: Shutdown Standby Preconditioning Constant Current Fast Charge Constant Voltage Charge Complete - Standby 600 Charge Current (mA) 500 400 300 200 100 0 25 35 45 55 65 75 85 95 105 115 125 135 145 Junction Temperature (C) VDD = 5.2V RPROG = 2 k STATUS OUTPUTS STAT Hi-Z Hi-Z L L L Hi-Z 1.6 second 50% D.C. Flashing (Type2) Hi-Z (Type 1) 1.6 second 50% D.C. Flashing (Type 2) Hi-Z (Type 1) 1.6 second 50% D.C. Flashing (Type 2) Hi-Z (Type 1) The MCP73113/4 shall limit the charge current based on the die temperature. The thermal regulation optimizes the charge cycle time while maintaining device reliability. Figure 5-1 depicts the thermal regulation for the MCP73113/4 device. Refer to Section 1.0 "Electrical Characteristics" for thermal package resistances and Section 6.1.1.2 "Thermal Considerations" for calculating power dissipation. . CHARGE CYCLE STATE Temperature Fault Timer Fault Preconditioning Timer Fault 5.12 BATTERY SHORT PROTECTION FIGURE 5-1: Charge Current (IOUT) vs. Junction Temperature (TJ). 5.10 THERMAL SHUTDOWN The MCP73113/4 suspends charge if the die temperature exceeds +150C. Charging will resume when the die temperature has cooled by approximately 10C. The thermal shutdown is a secondary safety feature in the event that there is a failure within the thermal regulation circuitry. Once a single-cell Li-Ion battery is detected, an internal battery short protection (BSP) circuit starts monitoring the battery voltage. When VBAT falls below a typical 1.7V battery short protection threshold voltage, the charging behavior is postponed. 25 mA (typical) detection current is supplied for recovering from battery short condition. Preconditioning mode resumes when VBAT raises above battery short protection threshold. The battery voltage must rise approximately 150 mV above the battery short protection voltage before the MCP73113/4 device becomes operational. 5.11 Status Indicator The charge status outputs are open-drain outputs with two different states: Low (L), and High Impedance (Hi-Z). The charge status outputs can be used to illuminate LEDs. Optionally, the charge status outputs can be used as an interface to a host microcontroller. Table 5-2 summarizes the state of the status outputs during a charge cycle. (c) 2010 Microchip Technology Inc. DS22183C-page 19 MCP73113/4 NOTES: DS22183C-page 20 (c) 2010 Microchip Technology Inc. MCP73113/4 6.0 APPLICATIONS The MCP73113/4 devices are designed to operate in conjunction with a host microcontroller or in standalone applications. The MCP73113/4 provides the preferred charge algorithm for Lithium-Ion and Lithium-Polymer cells Constant-current followed by Constant-voltage. Figure 6-1 depicts a typical standalone application circuit, while Figure 6-2 depicts the accompanying charge profile. MCP73113/4 Typical Application 1 Ac-dc Adapter 2 CIN RLED 7 VDD VDD STAT VBAT 3 COUT VBAT 4 PROG VSS 10 9 + 1-Cell Li-Ion Battery 5 NC 6 NC RPROG - VSS 8 FIGURE 6-1: 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 R PROG = 2 k 875 mAh Battery Typical Application Circuit. 6.1.1 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 105 120 COMPONENT SELECTION Battery Voltage (V) Supply Current (A) Selection of the external components in Figure 6-1 is crucial to the integrity and reliability of the charging system. The following discussion is intended as a guide for the component selection process. 6.1.1.1 Charge Current 15 30 45 60 75 90 Time (Minutes) FIGURE 6-2: Typical Charge Profile (875 mAh Battery). The preferred fast charge current for Li-Ion / Li-Poly cells is below the 1C rate, with an absolute maximum current at the 2C rate. The recommended fast charge current should be obtained from battery manufacturer. For example, a 500 mAh battery pack with 0.7C preferred fast charge current has a charge current of 350 mA. Charging at this rate provides the shortest charge cycle times without degradation to the battery pack performance or life. Note: Please consult with your battery supplier or refer to battery data sheet for preferred charge rate. 6.1 Application Circuit Design Due to the low efficiency of linear charging, the most important factors are thermal design and cost, which are a direct function of the input voltage, output current and thermal impedance between the battery charger and the ambient cooling air. The worst-case situation is when the device has transitioned from the Preconditioning mode to the Constant-current mode. In this situation, the battery charger has to dissipate the maximum power. A trade-off must be made between the charge current, cost and thermal requirements of the charger. (c) 2010 Microchip Technology Inc. DS22183C-page 21 MCP73113/4 6.1.1.2 Thermal Considerations The worst-case power dissipation in the battery charger occurs when the input voltage is at the maximum and the device has transitioned from the Preconditioning mode to the Constant-current mode. In this case, the power dissipation is: PowerDissipation = ( V DDMAX -V PTHMIN )xI REGMAX A minimum of 16V rated 1 F, is recommended to apply for output capacitor and a minimum of 25V rated 1 F, is recommended to apply for input capacitor for typical applications. TABLE 6-1: MLCC Capacitors X7R X5R MLCC CAPACITOR EXAMPLE Temperature Range -55C to +125C -55C to +85C Tolerance 15% 15% Where: VDDMAX IREGMAX VPTHMIN = = = the maximum input voltage the maximum fast charge current the minimum transition threshold voltage Power dissipation with a 5V, 10% input voltage source, 500 mA 10% and preconditioning threshold voltage at 2.7V is: Virtually any good quality output filter capacitor can be used, independent of the capacitor's minimum Effective Series Resistance (ESR) value. The actual value of the capacitor (and its associated ESR) depends on the output load current. A 1 F ceramic, tantalum or aluminum electrolytic capacitor at the output is usually sufficient to ensure stability. EQUATION 6-1: PowerDissipation = ( 5.5V - 2.7V ) x 550mA = 1.54W 6.1.1.4 Reverse-Blocking Protection This power dissipation with the battery charger in the DFN-10 package will result approximately 63C above room temperature. The MCP73113/4 provide protection from a faulted or shorted input. Without the protection, a faulted or shorted input would discharge the battery pack through the body diode of the internal pass transistor. 6.1.1.3 External Capacitors The MCP73113/4 are stable with or without a battery load. In order to maintain good AC stability in the Constant-voltage mode, a minimum capacitance of 1 F is recommended to bypass the VBAT pin to VSS. This capacitance provides compensation when there is no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These elements are in the control feedback loop during Constant-voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the inductive nature of the battery pack. DS22183C-page 22 (c) 2010 Microchip Technology Inc. MCP73113/4 6.2 PCB Layout Issues For optimum voltage regulation, place the battery pack as close as possible to the device's VBAT and VSS pins, recommended to minimize voltage drops along the high current-carrying PCB traces. If the PCB layout is used as a heatsink, adding many vias in the heatsink pad can help conduct more heat to the backplane of the PCB, thus reducing the maximum junction temperature. Figure 6-4 and Figure 6-5 depict a typical layout with PCB heatsinking. FIGURE 6-5: Typical Layout (Bottom). FIGURE 6-3: Typical Layout (Top). FIGURE 6-4: Typical Layout (Top Metal). (c) 2010 Microchip Technology Inc. DS22183C-page 23 MCP73113/4 NOTES: DS22183C-page 24 (c) 2010 Microchip Technology Inc. MCP73113/4 7.0 7.1 PACKAGING INFORMATION Package Marking Information 10-Lead DFN (3x3) Standard * XXXX YYWW NNN Part Number MCP73113-06SI/MF MCP73113-16SI/MF MCP73114-0NSI/MF Code 93HI 83HI 9MHI 93HI 0929 256 Example: Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. (c) 2010 Microchip Technology Inc. DS22183C-page 25 MCP73113/4 /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 0) [ [ 1RWH PP %RG\ >')1@ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ D N e N L b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page 26 (c) 2010 Microchip Technology Inc. MCP73113/4 /HDG 3ODVWLF 'XDO )ODW 1R /HDG 3DFNDJH 0) [ [ 1RWH PP %RG\ >')1@ )RU WKH PRVW FXUUHQW SDFNDJH GUDZLQJV SOHDVH VHH WKH 0LFURFKLS 3DFNDJLQJ 6SHFLILFDWLRQ ORFDWHG DW KWWS ZZZ PLFURFKLS FRP SDFNDJLQJ (c) 2010 Microchip Technology Inc. DS22183C-page 27 MCP73113/4 NOTES: DS22183C-page 28 (c) 2010 Microchip Technology Inc. MCP73113/4 APPENDIX A: REVISION HISTORY Revision C (January 2010) The following is the list of modifications: 1. DC Characteristics table: Removed the minimum and maximum values for the BSP Start Threshold parameter. Revision B (July 2009) The following is the list of modifications: 1. 2. 3. 4. Added MCP73114 device throughout the document. Updated specifications for the MCP73113/4 device family throughout the document. Updated package marking information. Updated Product Identification System page. Revision A (May 2009) * Original Release of this Document. (c) 2010 Microchip Technology Inc. DS22183C-page 29 MCP73113/4 NOTES: DS22183C-page 30 (c) 2010 Microchip Technology Inc. MCP73113/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package Examples: a) b) c) Device: MCP73113: MCP73113T: MCP73114: MCP73114T: Single Cell Li-Ion/Li-Polymer Battery Device Single Cell Li-Ion/Li-Polymer Battery Device, Tape and Reel Single Cell Li-Ion/Li-Polymer Battery Device Single Cell Li-Ion/Li-Polymer Battery Device, Tape and Reel MCP73113-06SI/MF: Single Cell Li-Ion/LiPolymer Battery Device MCP73113-16SI/MF: Single Cell Li-Ion/LiPolymer Battery Device MCP73113T-06SI-MF: Tape and Reel, Single Cell Li-Ion/LiPolymer Battery Device MCP73113T-16SI/MF: Tape and Reel, Single Cell Li-Ion/LiPolymer Battery Device MCP73114-0NSI/MF: Single Cell Li-Ion/LiPolymer Battery Device MCP73114T-0NSI/MF: Tape and Reel, Single Cell Li-Ion/LiPolymer Battery Device d) a) Temperature Range: I = -40C to +85C (Industrial) b) Package: MF = Plastic Dual Flat No Lead, 3x3 mm Body (DFN), 10-Lead (c) 2010 Microchip Technology Inc. DS22183C-page 31 MCP73113/4 NOTES: DS22183C-page 32 (c) 2010 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." * * * Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC32 logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. (c) 2010 Microchip Technology Inc. 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